Institute of Computer Technologies
provides the Design of topology
of PCBs according to IPC Standards
and rules for Design For Manufacturing (DFM)
and Design For Assembly (DFA).
The contract development
in ICTech includes
the production of a prototype,
preparation and handing over
to the customer
the complete design
documentation of the project
in accordance with the regulations.
Institute of Computer Technologies
offers a range of three, four and five-stage bandpass ceramic microwave filters.
It is possible to produce bandpass microwave filters according to the customer's technical specifications.
Since 2013 seminars for developers of printed circuit boards are held on a regular basis.
The format of the seminars - open dialogue of ICTech professionals and invited foreign experts with the audience.
Innovative technology, experience and practical examples of our development - a unique material for design engineers to ensure the quality and reliability of printed circuit boards, starting with the design phase.
News
Kyiv, Digtyarivska Street 53 A, office 222, tel.: tel.: +38 (044) 331-03-75; +38 (044) 451-58-80
e-mail: info@ictech.com.ua; kiev@ictech.com.ua
Institute of Computer Technologies
Design and manufacture of high complexity multilayer PCBs
Outsourcing electronics development and PCB design services
Manufacture of Printed Circuit Boards
Institute of Computer Technologies (ICTech) specializes in design and manufacture of high complexity multilayer printed circuit boards. ICTech engineering department provides technical support for the customers at all stages of their projects. Institute of Computer Technologies supplies PCBs from prototypes up to mass production. Our main goal is to provide our customers with the best quality, competitive price and best service level.
ICTech product range:
A wide range of dielectrics with various parameters are used to manufacture ML printed circuit boards. The most advanced materials (enhanced FR4, FR4 High Tg) allow producing boards with big layer quantity and complex route patterns.
A distinctive feature of microwave printed circuit boards is a wide range of high-frequency signals that are distributed through strip lines of transmissions. This fact is reflected in the special features of design of the microwave circuit boards and sets up special demands for the parameters of dielectrics and the quality of manufacture of the print pattern elements.
In the manufacture of microwave printed circuit boards high-frequency laminates are used. These materials are reinforced by glass fiber polymer and ceramic thermoset laminates with a little tangent of an angle of dielectric losses and a wide range of dielectric coefficient.
Flexible circuit boards (up to 8 layers) and flat flexible cables have significantly advantages over traditional wired cables in complex devices, reducing assembling cost and allowing to connect different connectors and components in different locations in 3D designs. The core materials are low thickness polyimide films and PET.
All the advantages of rigid and flex PCBs are combined into rigid-flex printed circuit boards. They allow to avoid using expensive high-speed "large" connectors and to reduce overall weight and size of device.
The main feature of metal core printed circuit boards is thick metal plate (such as Al, Cu, Fe) and thin dielectric with high thermal conductivity thus allowing to increase overall heat dissipation and easily attach board to heat sink.
The highest quality basic materials, sophisticated manufacturing processes and most advanced technologies are used for HDI printed circuit boards production. HDI PCB design has buried vias, blind laser micro vias, conductors width and gaps under 100 um.
Impedance controlled printed circuit boards are manufactured of materials with high stable parameters. A special attention is paid to the board’s stack up, route patterns of transmission lines. It allows to minimize the signal losses and provide high speed data transmission.
Backplane are big ssize multilayer printed circuit boards with over than 20 layers and with high thickness. Backplanes structure has thick copper foil, power bus, high speed and impedance control layers.
Backplanes can have holes for press-fit connectors and special technology back drilling holes.
Using of planar transformers minimizes size of devices and improves design reliability.
For manufacturing of planar transformers the dielectrics with high breakdown voltage and thick foil are used to maintain high currents and interlayer insulations.
Embedded components
PCBs with embedded components are the most complex to manufacture. Special technologies allow to include the lead free chip components, uncased transistors, diodes, etc. inside of multilayer PCBs. It is also possible to create the structure of the resistive layers which allows to form thin film resistors. The usage of embedded components can reduce the size and weight of the device, as well as increase reliability.
Multilayer PCBs
High Frequency PCBs
Flexible, rigid-flexible PCBs
Metal Core PCBs
HDI-Boards of high complexity
Impedance controlled PCBs
Backplane PCBs
Planar transformers
Embedded components
To order printed circuit boards you need to send us the PCB design or the design documentation files in the format of Gerber (RS-274X) and the file of drilling in the Excelon or HPGL format.
After the analysis of the design documentation the specialists of Institute of Computer Technologies would give advice to the customers to optimize the PCB layout.
Before starting the production of printed circuit boards ICTech engineers conduct a final check of the design documentation and coordinate parameters of the PCB with the customer.
Quality control of printed circuit boards is carried out in accordance with the demands of standard IPC-A-600. Upon request, there is the possibility for inspection of additional PCB’s parameters.
Each batch of printed circuit boards is accompanied with the output control report.
Electric control is carried out for all printed circuit boards.
Warranty on all printed circuit boards - within six months from the date of manufacture.
Delivery of printed circuit boards to the Ukrainian territory is free of charge.
Printed Circuit Board’s Design
Institute of Computer Technologies provides the topology design of PCBs of various types and complexity:
PCB design service includes:
During the PCB design engineers of Institute of Computer Technologies are guided by the requirements of IPC standards.
The development is subjected to the requirements of manufacturability and assembly of printed circuit boards (DFM and DFA principles).
Interactive tracing
3D visualization
Institute of Computer Technologies provides services of PCBs’ redesign.
PCBs’ redesign does not involve significant changes in the circuit project solutions and is required in the following cases:
Electronics Design and Development
Institute of Computer Technologies provides service of electronics design.
The key specialization are:
The benefits of cooperation with ICTech:
Technologies:
Function purpose: multichannel digital filter
DSP resources:
/x36 /128kb /166 МHz + 2x SDRAM /x32
/512 kB /143МHz
I/O resources :
/512 kB /143MHz
/512 kB /143MHz
Flash memory: NAND /x8/128 MB
Power supply: /5В /3.3V
Cooling: convective
Working temperature: -40..85 С.
Function purpose : Digital resolver processing
Analogue input: ADC /4x /12-bit /100 MSPS/75Оhm
DSP resources :
x16 /256 MB /DDR2-667
I/O resources:
P2P)
Flash memory: NOR /BPI /x16/32 MB
Power supply: /5V /±12V (Aux)
Cooling: convective /conductive
Working temperature: -40..85 С
Function purpose : ADC+DSP
Analogue input: 2xADC/14bit/210MSPS/ 50 Ohm
DSP resources :
x36 /36Mb /200 МHz
+ SDRAM/x64 /64 MB /133MHz
I/O resources:
MB /133МHz
Flash memory: NOR /BPI x16 /8 MB
Power supply: /5В /3.3V
Cooling: convective
Working temperature: -40..85 С
Function purpose: Video processing
DSP resources :
x16 /256MB /DDR2-667
MB/DDR2-667 (TMS320C667x + SDRAM x32 /512 MB/DDR3-1333)
I/O resources:
Flash memory: NOR /BPI
x16 /32 MB
Power supply: /5V
Cooling: convective /conductive
Working temperature: -40..85 С
Function purpose: DSP
DSP resources :
I/O resources:
Flash memory: NOR / BPI / x16 / 128MB
Power supply: /5V
Cooling: convective /conductive
Working temperature: -40..85 С
Function purpose: DSP+ADC
Analogue input: DSP+ADC
DSP resources :
I/O resources:
Flash memory: NOR / BPI / x16 / 128MB
Power supply: /5V
Cooling: convective /conductive
Working temperature: -40..85 С
Function purpose: signal generator
Analogue input: DSP+ADC
DSP resources :
I/O resources:
Power supply: /5V
Cooling: convective
Working temperature: -40..85 С
Function purpose: DSP+ADC
Analogue input:
24 x ADC / 12bit / 65MSPS / 50 Ohm
DSP resources :
DDR3 SDRAM / x16 / 1Gb / 800MHz
GMAC/40 GFLOP @ 1.2GHz + 4 x DDR3
SDRAM / x16 / 1Gb / 1333MHz
I/O resources:
Flash memory: NOR / BPI / x16 / 128MB
Power supply: /5V
Cooling: convective
Working temperature: -40..85 С
Function purpose: video processing
Analogue output:
3xDAC/14-bit/80MSPS/ 50 Ohm
DSP resources :
+ 4xZBTSRAM /x72 /36Mb /200 MHz
+ 2xSRAM / x32 / 32Mb / 100 MHz
MIPS + 2xSRAM /x32 /32Mb /100MHz
I/O resources:
Flash memory: 2xNOR/x16 /32MB
Power supply: ±12V/±5V/+3.3V
Cooling: convective
Working temperature: -40..85 ˚С
Function purpose: ADC+DSP
Analogue input:
ADC/12-bit/40MSPS/ 50 Ohm
DSP resources :
+ 12xZBTSRAM /x36 /36Mb /200 MHz
+ 4xSDRAM /x64 /64MB /133MHz
I/O resources:
+ SDRAM /x32 /512 KB /143MHz
Flash memory: NOR/BPI/x16 /8MB
Power supply: ±5V/+3.3V
Cooling: convective
Working temperature: -40..85 ˚С
04F6UCPCIV2PPLM - 6U /CompactPCI /4HP
02F3UVPXS6APLM - 3U /VPX /4HP
01F3UCPCIV4PLM - 3U /CompactPCI /4HP
03F3UVPXS6VPLM - 3U /VPX /4HP
06F3UVPXV6DPLM - 3U /VPX /4HP
07F3UVPXV6APLM - 3U /VPX /4HP
08Z3UVPXDFC - 3U / 4HP / VPX RTM
09F6UVPXAK7DSP - 6U / 4HP / HybridVPX
10F6UCPCIV2PLM - 6U / 4HP / CompactPCI
15F6UVMEV2P - 6U / 4HP / HybridVME
The service of electronics design includes manufacturing of a prototype and supplying of complete documentation set. All intellectual property rights, including documentation, designs, schematics and software will be granted to customer unless otherwise stated in contract.
Production of Microwave Filters
Institute of Computer Technologies offers a range of three, four and five-stage bandpass ceramic microwave filters.
The produced monolithic ceramic resonators provide the performance of microwave filters in a temperature range from -55 ° C to +85 ° C. The minimum level of insertion loss in the passband for the three-stage filters is not exceeding 1.5 dB.
Three-stage bandpass ceramic microwave filters
Four-stage bandpass ceramic microwave filters
Name | Center frequency, MHz |
Band width, MHz |
Insertion loss dB, not more |
Attenuation (dB) min, MHz |
Ripple in BW, dB, max |
V.S.W.R not more |
Overal ldimensions, mm |
---|---|---|---|---|---|---|---|
3PM1344E37B | 1334 | 20 | 1,0 | 40 dB ±66 | 1,0 | 1,0 | 18,5×6,5×9,3 |
3PM1555E37B | 1555 | 4 | 8,0 | 40 dB ±55 | 3,0 | 1,9 | 18,4×7×8,5 |
3PM1589E37B | 1590 | 40 | 1,5 | 40 dB ±180 | 1,0 | 1,6 | 18,4×7×8,8 |
3PM1189E37B | 1189,5 | 51 | 1,5 | 35 dB±175 | 3,0 | 1,5 | 12,5×4,5×12 |
Name | Center frequency, MHz |
Band width, MHz |
Insertion loss dB, not more |
Attenuation (dB) min, MHz |
Ripple in BW, dB, max |
V.S.W.R not more |
Overal ldimensions, mm |
---|---|---|---|---|---|---|---|
4PM1575E37B | 1575 | 20 | 4,5 | 35 dB ±45 | 1,1 | 1,5 | 17×4,8×9,1 |
4РМ1602Е37B | 1601,5 | 17 | 4,5 | 40 dB ±100 | 1,1 | 1,5 | 17×4,8×9,1 |
4РМ836Е37B | 838 | 35 | 3,0 | 60 dB ±100 | 1,0 | 1,5 | 25х6,8х15 |
4РМ881Е37B | 881 | 35 | 3,0 | 60 dB±100 | 1,0 | 1,5 | 25х6,8х14,7 |
4РМ897Е37B | 897 | 35 | 3,0 | 60 dB±100 | 1,0 | 1,5 | 25х6,8х14,7 |
4РМ942Е37B | 942 | 35 | 3,0 | 60 dB±100 | 1,0 | 1,5 | 25х6,8х14,5 |
4РМ1729Е37B | 1729 | 38 | 3,0 | 45 dB±100 | 1,0 | 1,5 | 25х6,8х8 |
4РМ1766Е37B | 1766 | 38 | 3,0 | 45 dB±100 | 1,0 | 1,5 | 25х6,8х7,8 |
4РМ1824Е37B | 1824 | 38 | 3,0 | 45 dB±100 | 1,0 | 1,5 | 25×6,8×7,6 |
4РМ1861Е37B | 1861 | 38 | 3,0 | 45 dB±100 | 1,0 | 1,5 | 25х6,8х7,4 |
4РМ1865Е37B | 1865 | 38 | 3,0 | 45 dB±100 | 1,0 | 1,5 | 25х6,8х7,4 |
4РМ1895Е37B | 1895 | 38 | 3,0 | 45 dB±100 | 1,0 | 1,5 | 25х6,8х7,2 |
4РМ1945Е37B | 1945 | 38 | 3,0 | 45 dB±100 | 1,0 | 1,5 | 25х6,8х7 |
4РМ1975Е37B | 1975 | 38 | 3,0 | 45 dB±100 | 1,0 | 1,5 | 25х6,8х6,8 |
4РМ2245Е37B | 2245 | 90 | 1,0 | 20 dB±100 | 0,5 | 1,3 | 25×6,0×7,0 |
Five-stage bandpass ceramic microwave filters
Name | Center frequency, MHz |
Band width, MHz |
Insertion loss dB, not more |
Attenuation (dB) min, MHz |
Ripple in BW, dB, max |
V.S.W.R not more |
Overal ldimensions, mm |
---|---|---|---|---|---|---|---|
5РМ1575Е37B | 1575 | 20 | 4,0 | 43,5 dB ±45 | 1,0 | 1,5 | 31×7×9 |
5РМ1601Е37B | 1600,5 | 15 | 4,5 | 43,5 dB ±45 | 1,0 | 1,5 | 31×7×9 |
5РМ1602Е37B | 1601,5 | 17 | 4,0 | 43,5 dB ±43,5 | 1,0 | 1,5 | 31×7×9 |
5РМ1588Е37B | 1588 | 40 | 2,5 | 40 dB±85 | 1,0 | 1,6 | 31×7×8,5 |
5РМ1589Е37B | 1590 | 40 | 2,5 | 40 dB±85 | 1,0 | 1,6 | 31×7×8,5 |
5РМ1593Е37B | 1595,5 | 51 | 2,5 | 40 dB±94,5 | 1,0 | 1,6 | 31х6,6х10 |
5РМ1238Е37B | 1248,5 | 27 | 2,5 | 40 dB±88,5 | 1,0 | 1,6 | 31х6,6х10 |
5РМ2068Е37B | 2067,5 | 83 | 1,5 | 30 dB±130 | 0,8 | 1,4 | 31×7×7 |
5РМ1736Е37B | 1756 | 16 | 4,0 | 40 dB±47 | 1,0 | 1,5 | 31х6,9х8,1 |
5РМ1783Е37B | 1783,25 | 10,5 | 4,0 | 35 dB±47 | 1,0 | 1,5 | 31х6,6х8,1 |
5РМ1796Е37B | 1796,25 | 12,5 | 4,0 | 40 dB±60 | 0,3 | 1,5 | 31х6,9х7,9 |
Quality control and acceptance of bandpass microwave filters is conducted in accordance with the requirements of All Union State standards 25360-82 and includes the following stepss:
1. Control of solderability after storage;
2. Weight checking;
3. Checking of electrical parameters;
4. Test of strength when subjected to a sinusoidal vibration;
5. Test of strength during transportation;
6. Functional testing at elevated operating temperature (+85 ° C);
7. Functional testing at a lower operating temperature (-55 ° C);
8. Testing of the impact of changes in ambient temperature (-60 to +90 °C).
The area of application of the following bandpass microwave filters is home appliances, as well as terminal telecommunications devices of military and industrial applications with high demands on the fault-tolerance of electronic equipment.
It is possible to produce bandpass microwave filters according to the customer's technical specifications.
Production of Stencils
Institute of Computer Technologies provides a service of the production of stencils made of stainless steel by method of laser cutting for surface-mounted assembly of PCBs .
The material thickness of the stencil:
Edge reinforcement of a stencil is performed by contact welding of additional strips of a material with thickness of 0.2 mm in the area of the perforation apertures.
Institute of Computer Technologies also offers multi-level stencils.
Multilevel stencil is used if it is necessary to apply solder cream with different layer of thicknesses on the PCB. This becomes necessary when mounting the individual electronic components with special requirements to the amount of solder paste.
Multilevel stencils can be made with the decrease of the individual apertures as well as with the increase. Also it is possible to make a stencil with several levels of thickness change.
Institute of Computer Technologies manufactures stencils on an aluminum frame.
Variations of aluminum extrusion section:
The maximum frame size is 736 x 736 mm.
Stencils on frame keep constant tension of the metal for a long time during the operation.
Stencils on frame are recommended for large-scale assembly of electronic products.
To eliminate the microroughness and to smooth sharp edges we recommend making stencils with the option of electrolytic polishing. This will ensure a better application of solder paste and will prevent the adhesion of the paste in narrow spots and corners of the apertures.
All stencils undergo the quality control of manufacturing on a specialised system of automatic optical inspection (AOI).
Specialists of the Institute of Computer Technologies will provide advice on the design of stencils to meet the requirements of specific lines of automatic mounting, on which it is planned to use the produced stencil .
PCBs Assembly Service
Institute of Computer Technologies provides electronics manufacturing services. Production sites are equipped with modern, reliable and high-tech production complex with all necessary equipment for automated and manual assembly.
TECHNOLOGICAL CAPABILITIES OF ASSEMBLY PRODUCTION:
Capability
Parameter
Acceptance criterion /quality control
PCB dimensions (max)
BGA assembly
uBGA assembly
Lead free packages CCGA, CSP, LGA assembly
Assembly of microchips with small pitch
Assembly of small sized passive components
Lead free assembly
Mixed BGA assembly (with lead and lead-free)
Non-standard elements assembly
Press-fit connectors pressing in
BGA repairing and reballing
Manufacture of cable-harness products
508x508x5,0 mm
pitch up to 0,4 mm
yes
yes
up to 0,4 mm
from 01005
yes
yes
yes
yes
yes
yes
IPC A-600
Requirements for
soldering and electronic
assemblies acceptance
criteria: IPC A-610,
J-STD-001
BGA, CSP, HDI Flip Chip:
J-STD-030
IPC-7094, IPC-7095
Components:
J-STD-020, J-STD-033,
J-STD-075
IPC 7711, 7721
IPC A-620
Certified Quality
Management System
ISO 9001:2015
Electrostatic
Protection System
ANSI ESD S20.20
Quality control system for
finished products according
to IPC standards
© 2016 Institute of Computer Technologies, LTD.
All Rights Reserved